Skip to content Skip to footer

Overcoming the Challenges of On-Wafer Load Pull Measurements at Millimeter-Wave Frequencies for 5G Applications

AUTHORS: R. Hilton and S.Dudkiewicz, Maury Microwave Corp

PUBLICATION HISTORY: MICROWAVE JOURNAL – JUNE 2018

ABSTRACT: This paper reviews the challenges of on-wafer load pull measurements at 5G mmW bands, specifically how high insertion losses can reduce the effectiveness of load pull and how to overcome these losses through the novel concept of hybrid-active load pull.